Method and apparatus for applying a material on a substrate

Details Method and apparatus for applying a material on a substrate Method and apparatus for applying a material on a substrate

C - Chemistry, Metallurgy

23

C

C23C 4/12 (2006.01) B05B 17/06 (2006.01) B05D 7/24 (2006.01) C23C 18/08 (2006.01) C23C 18/14 (2006.01)

Patent

CA 2693841

The invention provides a method for applying a material onto a substrate using a droplet printing technique wherein a gas stream is released into the direction of a substrate, which gas stream comprises a carrier gas and droplets of a suspension of the material or droplets of a solution of a precursor of the material or droplets of a precursor of the material as such, whereby the droplets in the gas stream are first maintained in a steady flow and subsequently in a converging flow before the droplets are contacted with the substrate. The invention further provides an apparatus for carrying out said method.

La présente invention concerne un procédé permettant d'appliquer une matière sur un substrat au moyen d'une technique d'impression par gouttelettes. Un courant de gaz est libéré en direction d'un substrat, le courant de gaz comprenant un gaz de support et des gouttelettes d'une suspension de la matière ou des gouttelettes d'une solution d'un précurseur de la matière ou des gouttelettes d'un précurseur de la matière en soi. Les gouttelettes présentes dans le courant de gaz sont d'abord maintenues dans un flux constant puis dans un flux convergent avant qu'elles ne soient mises en contact avec le substrat. L'invention concerne en outre un appareil permettant la mise en uvre dudit procédé.

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