Method and apparatus for applying solder flux to a printed...

Details Method and apparatus for applying solder flux to a printed... Method and apparatus for applying solder flux to a printed...

H - Electricity

05

K

H05K 3/22 (2006.01) B05B 12/06 (2006.01) B05B 12/12 (2006.01) B05B 13/02 (2006.01) B05B 15/04 (2006.01) B05B 15/08 (2006.01) B05D 1/02 (2006.01) B05D 7/00 (2006.01) B23K 1/20 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2118206

ABSTRACT OF THE INVENTION Apparatus and methods for a system and process for applying a flux coating to a circuit board by pulsing an airless spray gun on and off to achieve excellent circuit board through-hole penetration and uniform film thickness. An overspray collection system is provided which reduces overspray and increases material utilization and transfer efficiency. A gun positioning mechanism, which can be automated, accurately locates the gun relative to the circuit board.

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