Method and apparatus for assembling electronic devices

Details Method and apparatus for assembling electronic devices Method and apparatus for assembling electronic devices

H - Electricity

05

K

26/14, 347/35

H05K 1/18 (2006.01) H05K 3/30 (2006.01) H05K 3/36 (2006.01)

Patent

CA 1071747

Abstract of the Disclosure Disclosed is a method of assembling electronic devices starting with providing a conductive substrate having first regions which support electronic components, second regions which electrically and mechanically interconnect various first regions and undesired third regions which provide temporary mechanical support for the first and second regions; adding a mass of insulative molding material for encapsulating portions of the first and second regions, cutting away unde- sired third regions and mounting electronic components. A substrate useful in carrying out the method of the invention is also disclosed. This substrate is particularly useful for assembling the components of an electronic digital watch.

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