Method and apparatus for attaching electronic components to...

H - Electricity – 05 – K

Patent

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Details

H05K 13/04 (2006.01) B23K 1/005 (2006.01) B23K 1/20 (2006.01) B23K 3/06 (2006.01) H05K 3/32 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2240184

There is disclosed herein a method for attaching an electronic component having at least one termination to a substrate having a respective mounting pad for each termination. One approach to this method comprises: providing the electronic component and substrate, placing the electronic component on the substrate such that each component termination rests atop its respective mounting pad, selectively preheating at least one selected mounting pad to a predetermined temperature without significantly raising the temperature of the substrate as a whole, and dispensing a predetermined amount of bonding compound onto each selected mounting pad immediately after the preheating step.

Méthode de fixation d'un composant électronique, ayant au moins une terminaison, sur un substrat. Ce substrat comprend un coussin de montage respectif pour chaque terminaison. Cette méthode consiste notamment à : obtenir le composant électronique et le substrat; placer le composant sur le substrat de façon à ce que chaque terminaison repose sur son coussin de montage respectif; préchauffer sélectivement au moins un coussin de montage à une température prédéterminée sans augmenter considérablement la température du substrat dans son ensemble; placer un composé liant en quantité prédéterminée sur chaque coussin de montage immédiatement après l'étape de préchauffage.

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