Method and apparatus for bonding thermoplastic materials

B - Operations – Transporting – 29 – C

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18/972

B29C 65/02 (2006.01)

Patent

CA 1130071

318,226 METHOD AND APPARATUS FOR BONDING THERMOPLASTIC MATERIALS ABSTRACT OF THE DISCLOSURE A method and apparatus is disclosed for bonding two pieces of thermoplastic material to one another. The method includes the steps of heating the edges of the plastic materials to be joined to at least their fusing temperatures and then forcing the heated edge portions against one another to thereby form a bonded junction. A bead is formed along at least one edge of the junction of the plastic materials as a result of the pressure of the two plastic materials bearing against one another. The welded junction is heated, optionally at elevated pressure, to at least its fusion temperature and is then rapidly cooled. The resulting weld has a high impact and dielectric strength and has a smooth overall appearance.

318226

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