Method and apparatus for burying waveguide paths

Details Method and apparatus for burying waveguide paths Method and apparatus for burying waveguide paths

B - Operations, Transporting

01

J

B01J 19/08 (2006.01) B05D 1/02 (2006.01) C03C 21/00 (2006.01) G02B 6/12 (2006.01) G02B 6/134 (2006.01) G02B 27/10 (2006.01) H01L 21/22 (2006.01)

Patent

CA 2084218

Abstract of the Disclosure Optical waveguide paths are formed under the surface of a glass substrate by a method comprising (a) forming by ion-exchange a dopant ion path on a first substrate surface, (b) applying an electrode to the second surface, (c) contacting the first surface with a molten salt bath, and (d) applying an electrical field across the substrate to drive the dopant ions deeper into the substrate. The apparatus comprises means (37) for supporting the substrate (13') such that the first substrate surface (17') is in contact with the molten salt bath (10'). A porous electrode (19') is disposed on the second surface (18') of the substrate. Means (23') applies a voltage to the porous electrode and the bath to create the electrical field. The substrate supporting means (37) includes a planar conductive surface (42) for contacting the porous electrode (19'). A groove (41) extends around the periphery of the conductive surface, and means (40, 43) evacuates the groove and removes oxygen from porous electrode (19'). A glass insulating ring (35) can be affixed to the periphery of the second surface (18') to prevent salts from the bath (10') from migrating up the side surfaces of the substrate by capillary action.

Affiliated with

Also associated with

Rating

Method and apparatus for burying waveguide paths does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for burying waveguide paths, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for burying waveguide paths will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1893236