Method and apparatus for cleaving semiconductor wafers

Details Method and apparatus for cleaving semiconductor wafers Method and apparatus for cleaving semiconductor wafers

H - Electricity

01

L

H01L 21/78 (2006.01) B28D 5/00 (2006.01)

Patent

CA 2115744

2115744 9304497 PCTABS00020 A method and apparatus are described for cleaving a relatively thin semiconductor wafer for inspecting a target feature on a workface thereof by: producing, on a first lateral face of the semiconductor wafer, laterally of the workface on one side of the target feature, an indentation in alignment with the target feature; and inducing, e.g., by impact, in a second lateral face of the semiconductor wafer, laterally of the workface on the opposite side of the target feature, a shock wave substantially in alignment with the target feature and the indentation on the first lateral face, to split the semiconductor wafer along a cleavage plane essentially coinciding with the target feature and the indentation.

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