Method and apparatus for coating semiconductor components on...

Details Method and apparatus for coating semiconductor components on... Method and apparatus for coating semiconductor components on...

H - Electricity

01

L

117/115, 32/27

H01L 21/56 (2006.01) H01L 21/00 (2006.01) B05C 9/04 (2006.01)

Patent

CA 1334245

Apparatus for applying a coating to semiconductor chips mounted within apertures in a dielectric film. The film containing the semiconductor chips and input-output connectors is fed from a reel past an applicator for applying the coating on one side of the chips. After passing through a curing chamber, the film passes about a substantially square sprocket so as to reverse the direction of travel. The sprocket is of such a dimension that the film bends on a line between each individual chip or a selected group of chips. The strip then passes by another applicator for coating the other side of the chips. After passing through the curing chamber, including a substantially square sprocket, the film is wound on a driven sprocket. The coating may be a silicone composition, an epoxy resin, or a urethane composition.

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