Method and apparatus for conducting heat to or from an...

Details Method and apparatus for conducting heat to or from an... Method and apparatus for conducting heat to or from an...

H - Electricity

01

J

356/187

H01J 37/00 (2006.01) C23C 14/54 (2006.01) C30B 23/06 (2006.01) C30B 31/22 (2006.01) H01J 37/02 (2006.01) H01L 21/265 (2006.01) H01L 23/44 (2006.01)

Patent

CA 1159161

APPLICATION FOR UNITED STATES PATENT METHOD AND APPARATUS FOR CONDUCTING HEAT TO OR FROM AN ARTICLE BEING TREATED UNDER VACUUM Abstract of Disclosure A method and apparatus are disclosed for providing heat conduction between an article being treated in a vacuum and a support member by providing a gas under pressure of about 0.5 to 2.0 Torr between the article and the support member. The method and apparatus are described for use in a semiconductor wafer ion implantation system wherein the wafer is clamped to the support member which is cooled. A seal can be provided between the wafer and the support member adjacent the periphery of the article.

359913

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