Method and apparatus for control of electroless plating...

Details Method and apparatus for control of electroless plating... Method and apparatus for control of electroless plating...

C - Chemistry, Metallurgy

23

C

32/2, 117/80, 34

C23C 18/16 (2006.01)

Patent

CA 1112523

ABSTRACT This invention relates to a method of operating an electroless copper plating bath and avoiding decomposition thereof which comprises measuring the mixed potential of the bath solution and adjusting one or more other bath parameters to maintain the mixed potential within a predetermined range. This invention also relates to an apparatus for measuring the mixed potential and adjusting one or more other bath parameters.

291214

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