H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/06 (2006.01) C23F 1/08 (2006.01) H01L 21/00 (2006.01)
Patent
CA 2123115
2123115 9309563 PCTABS00022 A method and apparatus (10) is provided for controlled spray etching, in which panels, such as printed circuit boards (P) are delivered through an etching chamber (10), to have a spray etchant sprayed generally on upper and lower surfaces of the panel (P). The spray is controlled such that a reduced amount of etchant is provided on the perimeter surface (51, 52) portions of the panel, relative to the central surface (71) portions of the panel (P), transversely of the path of travel of the panels (P) through the etching chamber (10). The spray may be varied in amount, preferably by varying the pressure at different locations transversely of the chamber; the spray longitudinally through the chamber, may vary, to spray leading (51) and trailing surface (52) portions of the panels (P) a lesser amount than central portions (71) of the panels (P), measured longitudinally. The control of the spray of leading (51) and trailing surface (52) portions of the panel (P) may be facilitated by one or more sensors (50, 50') that control an intermittent discharge of spray etchant near the inlet (15) to the etch chamber (10).
Ball Donald F.
Ketelhohn Karl F. G.
Atotech Usa Inc.
Bereskin & Parr
LandOfFree
Method and apparatus for controlled spray etching does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for controlled spray etching, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for controlled spray etching will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2090094