G - Physics – 01 – R
Patent
G - Physics
01
R
356/198
G01R 31/28 (2006.01)
Patent
CA 1249075
Abstract of the Disclosure A method for determining the position of a lapped edge of a substrate during lapping of a row of thin film magnetic transducer elements. First and second electrical lapping guide structures are formed on each side of the row of transducer elements. The lapping guide structures include a series of switching junctions, each switching junction paralleled by a resistor. A lapping resistor which provides a change in resistance proportional to the lapping of the row is measured and compared with the position of the lapping plane as determined from each switching junction change of state. Calibration of the resistor versus lapping plane position is effected to permit an accurate determination of the lapped surface from subsequent resistance measurements of the lapping resistor.
528223
International Business Machines Corporation
Kerr Alexander
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