Method and apparatus for cooling a circuit component

Details Method and apparatus for cooling a circuit component Method and apparatus for cooling a circuit component

G - Physics

06

F

G06F 1/20 (2006.01) H01L 23/367 (2006.01) H01L 23/467 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2488700

An apparatus (41, 441) includes a thermally conductive section (141, 241, 341, 444, 541) with a side facing approximately parallel to an axis (158) and adapted to be thermally coupled to a circuit component (36), and includes a fluid supply section (121) which directs a fluid flow along the axis toward an opposite side of the thermally conductive section. The thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.

L'invention concerne un appareil (41, 441) comprenant une section à conductivité thermique (141, 241, 341, 444, 541) munie d'un côté faisant face à un axe de manière approximativement parallèle (158) et conçue pour être couplée thermiquement à un composant de circuit (36). Ledit appareil comporte aussi une section de distribution de fluides (121) qui permet de diriger un flux de fluide le long de l'axe en direction d'un côté opposé de la section à conductivité thermique. Cette section à conductivité thermique permet de séparer le flux de fluide en une pluralité de parties de flux qui s'écoulent respectivement à travers la section à conductivité thermique dans une direction pratiquement parallèle à un plan perpendiculaire à l'axe, les parties du flux sortant de la section à conductivité thermique au niveau d'une pluralité d'emplacements respectifs disposés le long d'une portion substantielle de la périphérie de ladite section.

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