Method and apparatus for cooling semiconductor chips

Details Method and apparatus for cooling semiconductor chips Method and apparatus for cooling semiconductor chips

H - Electricity

01

L

H01L 23/46 (2006.01) H01L 23/40 (2006.01)

Patent

CA 2644234

A cooling apparatus for cooling a heat-generating chip mounted in a socket on a circuit board, the socket including a cradle having a standard heat-sink receiving configuration, includes an evaporator having a thermally conductive front face, a compressor in fluid communication with the evaporator for delivering refrigerant thereto, and an evaporator mount for coupling the evaporator to the heat-generating chip with the front face adjacent thereto. The mount includes a housing having coupling elements for connection to the cradle. The housing has an interior in which a housing insulation pack is provided for retaining the evaporator therein. The mount further includes a cradle insulation pack for maintaining the socket in moisture-free condition.

L'appareil selon l'invention servant à refroidir une puce génératrice de chaleur montée dans un connecteur sur une carte de circuit imprimé, le connecteur comportant un berceau présentant une configuration de réception de dissipation de chaleur, comprend un évaporateur comportant une face avant conductrice de chaleur, un compresseur en communication fluidique avec l'évaporateur servant à l'alimenter en réfrigérant, et un support d'évaporateur servant à coupler l'évaporateur à la puce génératrice de chaleur, la face avant étant adjacente à la puce. Le support comprend un boîtier comportant des éléments de couplage pour la connexion au berceau. Le boîtier comprend une partie intérieure dans laquelle un bloc isolant est disposé pour contenir l'évaporateur. Le support comprend en outre un bloc d'isolation de berceau pour protéger le connecteur de l'humidité.

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