Method and apparatus for cutting insulating material

Details Method and apparatus for cutting insulating material Method and apparatus for cutting insulating material

B - Operations, Transporting

23

K

327/117

B23K 11/22 (2006.01) B23H 7/02 (2006.01) B28D 5/00 (2006.01) B28D 5/04 (2006.01)

Patent

CA 1068793

METHOD AND APPARATUS FOR CUTTING INSULATING MATERIAL Abstract of the Disclosure A method and an apparatus for cutting insulating material (e.g., quartz) having a conductive layer on the surface thereof includes the use of a thin copper wire having diamond particles imbedded therein. The wire is moved in a direction perpendicular to the surface of the material. A source of potential is coupled between the wire and the layer, and a liquid solution is supplied between the wire and the conductive layer resulting in electro-erosion of portions of the layer proximate to the wire. A tension sensor detects wire displacements at the quartz cutting site and controls a wire-to-layer gap detector which in turn interrupts the displacement of the insulating material.

275027

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