B - Operations – Transporting – 26 – D
Patent
B - Operations, Transporting
26
D
40/18, 164/18, 1
B26D 5/00 (2006.01) B26F 1/40 (2006.01) B29C 65/74 (2006.01) B29C 65/78 (2006.01) D06H 7/22 (2006.01) B29C 65/08 (2006.01)
Patent
CA 1183448
METHOD AND APPARATUS FOR CUTTING WOVEN LABELS ABSTRACT A method and an apparatus for cutting woven labels. According to the invention, the woven labels, in the form of a continuous ribbon or the like, are fed step by step towards an ultrasonic wave cutting device, where each label is centred and pressed between a first cutt- ing element defining the outline of the label and a se- cond cutting element, aligned with the first, constitu- ting an ultrasonic wave emitter; an ultrasonic impulse of adequate frequency and intensity, causes the cutting and simultaneous cold welding of the label all around the edges.
403404
Gowling Lafleur Henderson Llp
Mion (a.) S.p.a. Nastrificio
LandOfFree
Method and apparatus for cutting woven labels does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for cutting woven labels, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for cutting woven labels will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1296724