Method and apparatus for debossing and selectively...

B - Operations – Transporting – 29 – C

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

18/1054, 154/83,

B29C 59/06 (2006.01) A61F 13/15 (2006.01) B26F 1/26 (2006.01)

Patent

CA 1187778

ABSTRACT Method and apparatus for constructing a three-dimensional film forming structure for imparting a selectively apertured three-dimensional pattern to a heated plastic material which is either fed in film form from a supply roil or extruded as a melt directly onto the surface of said forming structure and subjected to a fluid pressure differential while in contact with its surface. In a preferred embodiment, the film forming structure comprises a stacked laminate of initially imperforate planar sheets having continuous patterns of apertures therein and at least one initially perforate selectively apertured planar sheet located beneath the uppermost continuously apertured sheet. The laminate forming structure is preferably tubular in shape so as to facilitate contin- uous plastic web processing against its outermost surface. Film to be debossed and selectively aper- tured is brought in contacting relation with the laminate structure and subjected to a fluid pressure differential on said forming structure while at a temperature above its softening temperature. The fluid pressure causes the heated plastic film to be debossed in those areas where said initially perforate selectively apertured lamina contacts the film and debossed and apertured in those areas where said initially perforate selectively apertured lamina does not contact the film. The debossed and selectively apertured film is thereafter cooled below its softening temperature before removal from the forming structure.

395314

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for debossing and selectively... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for debossing and selectively..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for debossing and selectively... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1177599

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.