Method and apparatus for dicing a substrate

Details Method and apparatus for dicing a substrate Method and apparatus for dicing a substrate

H - Electricity

01

L

H01L 21/78 (2006.01) B23K 26/12 (2006.01) B23K 26/14 (2006.01) C03B 33/09 (2006.01) H01L 21/82 (2006.01)

Patent

CA 2180584

A continuous wave-oscillation CO2 laser beam 3 is converged by a lens 4 and focused at a predetermined place O between the surface of the substrate 1 and a tip of a nozzle of a guide 5. Then it is expanded to be a beam 3a having a beam spot diameter of S at the surface of the substrate 1. A flow of assist gas G0, G1, G2 having a certain constant pressure supplied from a gas intake 6 surrounds the laser beam 3. As the laser beam 3a is defocused, the beam spot diameter S is expanded and its energy distribution is moderated. And as the gas is blown off on the substrate 1 at constant pressure, such moderation is facilitated and expanded, generation of strains due to thermal deformation is suppressed.

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