Method and apparatus for dispensing components from vertical...

H - Electricity – 05 – K

Patent

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356/22

H05K 13/04 (2006.01)

Patent

CA 1303244

AT9-88-001 METHOD AND APPARATUS FOR DISPENSING COMPONENTS FROM VERTICAL STACK Abstract A method and apparatus are provided for positioning electronic components, such as surface-mounted chips or the like, for subsequent placement on circuit board. Support means disposes a plurality of such components in a stack adjacent the board. Stripping means in slidable engagement with the support means sequentially urges each chip in the stack transversely from a first position therein to a second position opposing a corresponding desired site on the board where the chip is to be placed. The support means includes a mounting block having connector means for releasable interconnection of the positioning apparatus to a top plate. Chamber means maintain the chip at the second position in response to fluid pressure differential. The support means is further adapted to receive a chip placement means for transporting the chip from the second position to a third position wherein it engages the board site. Means are provided for adjusting orientation of the chip during movement from the first to the second position to insure proper alignment on the site.

586915

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