B - Operations – Transporting – 05 – C
Patent
B - Operations, Transporting
05
C
32/3, 117/64
B05C 3/20 (2006.01) B05D 1/32 (2006.01) B23K 3/06 (2006.01) H05K 3/12 (2006.01) H05K 3/22 (2006.01)
Patent
CA 1258013
Abstract An apparatus for dispensing solder paste into openings in a stencil comprises a housing having a piston slidably mounted therein. A manifold, having a successively increasing cross-sectional area, is attached to a side wall of the housing for admitting a viscous material, such as solder paste therein through successively larger sized openings so the paste is distributed evenly beneath the piston. A pair of elastomeric blades are secured to, and depend from the housing on opposite sides of a slot to contact the stencil. Upon the application of a fluid pressure against the piston, paste will be expelled from the slot within a working region between the blades. The blades force paste into the openings in the stencil when the housing is moved thereacross.
529902
Schoenthaler David
Wojcik Thadeus
American Telephone And Telegraph Company
Kirby Eades Gale Baker
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