Method and apparatus for dissipating heat from an integrated...

Details Method and apparatus for dissipating heat from an integrated... Method and apparatus for dissipating heat from an integrated...

G - Physics

01

R

G01R 31/26 (2006.01)

Patent

CA 2644752

An apparatus (100) is provided for dispersing heat from an integrated circuit (202) to a heat sink (404). The apparatus (100) is formed on a nonconductive body (102) having at least two conductive surfaces (110, 112) disposed thereon. One of the conductive surfaces (110) is reflowed to a heat generating lead of the integrated circuit (202), and the other conductive surface (112) provides a surface for contacting a heat sink (404). The apparatus (100) and integrated circuit provide a package (200) which can be tape and reeled (300) for easy mounting to a printed circuit board (402) of a communication device (400).

La présente invention concerne un appareil (100) pour disperser la chaleur d'un circuit intégré (202) vers un dissipateur thermique (404). L'appareil (100) est formé sur un corps non conducteur (102) ayant au moins deux surfaces conductrices (110, 112) disposées dessus. L'une des surfaces conductrices (110) est renvoyée vers un fil générateur de chaleur du circuit intégré (202) et l'autre surface conductrice (112) fournit une surface pour faire contact avec le dissipateur thermique (404). L'appareil (100) et un circuit intégré fournissent un emballage (200), qui peut être collé et roulé (300) pour un montage facile sur une carte à circuit imprimé (402) d'un dispositif de communication (400).

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