Method and apparatus for electrical component physical...

H - Electricity – 05 – K

Patent

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H05K 5/00 (2006.01) B64D 45/00 (2006.01)

Patent

CA 2673800

An enclosure (100) for protecting a heat sensitive component from high temperature, shock, and moisture is provided. The enclosure includes an outer housing (102) surrounding an inner cavity (104) configured to receive a heat sensitive component (121) therein, and a cover (108) configured to matingly engage the outer housing such that the inner cavity is sealed from an environment external to the enclosure, wherein at least one of the outer housing and the cover are formed from a ceramic material.

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