Method and apparatus for electrolytically plating copper

Details Method and apparatus for electrolytically plating copper Method and apparatus for electrolytically plating copper

C - Chemistry, Metallurgy

25

D

C25D 3/38 (2006.01) C25D 17/12 (2006.01)

Patent

CA 2105724

METHOD AND APPARATUS FOR ELECTROLYTICALLY PLATING COPPER Abstract of the Disclosure A method for electrolytically plating copper onto a base metal, such as steel (18), utilizing an insoluble anode (16) includes the steps of: providing a pyrophosphate plating solution (14); adding a copper source, copper hydroxide, to the plating solution (14); and passing an electric current through the plating solution between the insoluble anode (16) and the base metal (18) to be plated. The apparatus (10) includes a plating tray (12), a pyrophosphate plating solution (14) including a soluble source of copper, an insoluble anode (16) and a power source (20). A copper plated product (P) is also disclosed and claimed.

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