Method and apparatus for electroplating a metallic deposit...

C - Chemistry – Metallurgy – 25 – D

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C25D 5/02 (2006.01) C25D 7/06 (2006.01)

Patent

CA 1314519

ABSTRACT A method for fast and accurate plating of a metal on two opposite sides of a component that results in a considerable saving of metal is provided. The metal may be a precious metal. In the case of double sided plating the saving is approximately 50%. Apparatus for carrying out the method includes a transport device for lengthwise transport of bandoliered or otherwise interconnected elongated components. A device for placing and removing non-conductive masking devices in between the elongated components operates in synchronizism with the transport device. Objects to be plated and the masking devices between them are brought into contact with electrolyte on one side or two sides simultaneously at choice.

533612

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