Method and apparatus for fabricating high fin-density heatsinks

Details Method and apparatus for fabricating high fin-density heatsinks Method and apparatus for fabricating high fin-density heatsinks

B - Operations, Transporting

23

P

B23P 15/26 (2006.01) B23P 11/00 (2006.01) B23P 19/04 (2006.01) F28F 3/06 (2006.01) F28F 9/26 (2006.01)

Patent

CA 2542169

A dual base plate heatsink for use in dissipating heat for electronic devices has sufficient thermal contact between fins and the base plates and is manufactured without the requirement for welding. Separately extruded fins are connected to both base plates by placing the fins side by side in channels in both base plates. In order to couple the base plates and the fins, the base plates are maintained at a constant relative distance and a swaging tool is passed adjacent the fins and between the base plates in a direction parallel to the surface of the base plates. The swaging tool asserts pressure to the base plates to thereby swage the base plates against the ends of the fins. Undesirable warping of the base plates during the process is reduced or prevented by providing a base plate configuration that minimises the bending moment between the swaged base plate material and the rest of the base plate.

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