Method and apparatus for filling high density vias

Details Method and apparatus for filling high density vias Method and apparatus for filling high density vias

H - Electricity

01

L

356/134

H01L 21/48 (2006.01) H05K 3/40 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2007661

ABSTRACT A method for providing void-free low-electrical- resistance conductive cores in vias having an aspect ratio of greater than approximately 6 includes the steps of providing a conductive thixotropic paste on the top surface of a substrate having vias provided therein, applying pressure to the paste and concurrently applying pressure to the vias at the bottom surface of the substrate to force the thixotropic paste into the vias. Vibratory motion may also be applied to the substrate and paste concurrently with the application of pressure and vacuum. The paste is then dried in a vacuum, and subsequently sintered in a two-step process including a slow ramp up to temperature to allow the paste to outgas followed by a high temperature treatment. WP1/MEM/AMDH/6033.001 Attorney Docket No.: AMDH6033DEL/MEM 1/25/89-10:26

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