Method and apparatus for fluxing and soldering terminals on...

Details Method and apparatus for fluxing and soldering terminals on... Method and apparatus for fluxing and soldering terminals on...

H - Electricity

05

K

H05K 3/34 (2006.01) B23K 1/20 (2006.01)

Patent

CA 2157225

Fluxing and soldering terminals on a printed circuit board in an in-line process in which a wall of flux is directed against a surface of the board which moves in inclined manner as it passes through a fluxing station and towards a soldering station. The process controls flux application to decrease the amount of flux applied from the leading end to the trailing end of the board, the board inclination resulting in flow of flux to redistribute it towards providing a constant flux thickness for the soldering step. Particularly useful for processes involving "no-clean" flux application where residual flux after soldering is to be avoided because of potential electrical problems.

Affiliated with

Also associated with

Rating

Method and apparatus for fluxing and soldering terminals on... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for fluxing and soldering terminals on..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for fluxing and soldering terminals on... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1361004