B - Operations – Transporting – 22 – F
Patent
B - Operations, Transporting
22
F
B22F 5/00 (2006.01)
Patent
CA 2528754
One or more holes that extend through a wall of a powder metal component are formed by creating an absence of powder metal in a die set during compaction at an interface between a side surface of a punch and another side surface of the die set that faces the side surface of the punch in substantially close proximity to create the absence of powder metal at the interface.
L'invention concerne un ou plusieurs trous s'étendant à travers une paroi d'un composant de métal en poudre formé par création d'une absence de métal en poudre dans une carcasse durant le compactage au niveau d'une interface entre une surface latérale d'un perforateur et une autre surface latérale de la carcasse faisant face à la surface latérale du perforateur suffisamment proche de façon à créer l'absence de métal en poudre au niveau de l'interface.
Bcf Llp
Gkn Sinter Metals Inc.
LandOfFree
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