Method and apparatus for forming electrode on electronic...

Details Method and apparatus for forming electrode on electronic... Method and apparatus for forming electrode on electronic...

H - Electricity

05

K

356/6

H05K 3/22 (2006.01) H01C 17/28 (2006.01) H01G 13/00 (2006.01) H01L 21/00 (2006.01) H05K 3/40 (2006.01) H05K 1/09 (2006.01) H05K 3/12 (2006.01)

Patent

CA 2005729

ABSTRACT OF THE DISCLOSURE Disclosed herein is a method of forming strip-shaped electrodes over an end surface of a plate-shaped electronic component and two major surfaces which are in series with the end surface. A slit plate, which is provided with through slits having width corresponding to the width of electrodes to be formed, is located above an electrode paste bath while an electronic component is arranged above the slit plate so that its end surface extends across the through slits. Before or after this step, the electrode paste is made to swell to a constant level beyond the upper surface of the slit plate, thereby applying the electrode paste to the end surface of the electronic component and the two major surfaces which are in series with the end surface in the form of strips.

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