B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
18/660
B29C 45/17 (2006.01) B29C 44/34 (2006.01)
Patent
CA 1176418
ABSTRACT This apparatus is used to improve the heat distribution on the cavity surface in foam molding dies where a smooth finish on the resin filled foam molded plastic product manufactured by an injection molding process is desired. This invention improves the method for heating the mold cavity using a condensing vapor in a molding die by a channel and slit type orifice means in the mold around a portion of the periphery of the part to be molded. Another channel and slit type orifice means around the remaining periphery is included in the die for removing the condensing vapor or condensate from the mold cavity. During the heating process when condensing vapor is introduced into the mold the spruce opening to the extruder is sealed by a valve means to prevent condensate from collecting therein.
398846
Han Je-Chin
Hendry James W.
Ex-Cell-O Corporation
Macrae & Co.
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