Method and apparatus for improved fold retention on a...

Details Method and apparatus for improved fold retention on a... Method and apparatus for improved fold retention on a...

H - Electricity

05

K

H05K 5/02 (2006.01) G06F 21/00 (2006.01) G08B 13/12 (2006.01) H05K 5/06 (2006.01)

Patent

CA 2345433

A method and apparatus for forming a security enclosure having improved fold retention. In particular, the enclosure is formed by folding a flexible tamper respondent cloth around an electronic assembly. An adhesive on the inner folded surfaces of the cloth temporarily retains the folds. The enclosure is then exposed to heat and pressure to promote improved adhesion strength of the adhesive, thereby improving told retention.

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