G - Physics – 01 – R
Patent
G - Physics
01
R
G01R 31/26 (2006.01) G01R 31/28 (2006.01) G01R 31/3163 (2006.01) G01R 31/3167 (2006.01) G01R 31/3181 (2006.01) H01L 21/60 (2006.01) H01L 21/66 (2006.01)
Patent
CA 2110472
A method of testing semiconductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip carrier is provided. The chip carrier has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into conductive contact with the conductor pads on the chip carrier. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing, the chip may be removed from the substrate. Alternatively, the chip may be bonded through the dendritic conductor pads to the substrate after successful testing.
Bhatt Anilkumar Chinuprasad
Buda Leo Raymond
Edwards Robert Douglas
Hart Paul Joseph
Ingraham Anthony Paul
International Business Machines Corporation
Saunders Raymond H.
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