C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/11, 204/122,
C25D 5/08 (2006.01) C25D 5/00 (2006.01) C25D 7/04 (2006.01) C25D 17/00 (2006.01) C25F 1/00 (2006.01) C25F 3/00 (2006.01) C25F 3/16 (2006.01) C25F 7/00 (2006.01)
Patent
CA 1051370
Abstract of the Disclosure A dielectric processing chamber unit for use in electroprocessing large surface areas including electro- polishing and electroplating. The processing chamber unit has an open face, an open top, a sealing strip, an electro- lyte inlet and an electrode. The processing chamber unit is placed with its open face against a surface to be electro- processed and an electrolyte is introduced into the chamber through the inlet. The inlet is located so that the enter- ing electrolyte dislodges gas bubbles formed during electro- processing and then both the electrolyte and gas leave the chamber through its open top. A method of electroprocessing a surface using such a processing chamber unit whereby a relatively small amount of electrolyte is used and recirculated during processing. In this method, the chamber unit is used to electroprocess the inner surface of a vessel concentric about its longi- tudinal axis whereby the processing chamber unit is temp- rarily mounted from a shaft maintained on this axis and the chamber unit is rotated around the interior of the vessel during the electroprocessing procedure.
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