Method and apparatus for inductively coupled plasma treatment

H - Electricity – 01 – J

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H01J 37/32 (2006.01)

Patent

CA 2399951

The apparatus for plasma treatment of a non-conductive hollow substrate (5), comprises a plasma chamber (12) provided with two oppositely facing field admission windows (8, 9), and first and second opposite coil arrangements (20, 30) located on an outer surface (8a; 9a) of the first and second windows respectively. The first and second coil arrangements being connected to power supply means (4) such that a current (I) of a same direction flows simultaneously in the first and second coil arrangements. The two coil arrangements (20, 30) induce through the substrate a magnetic flux (7) transversal and perpendicular to a substrate depth (L) for generating an electrical field in the substrate plan.

L'invention concerne un appareil destiné au traitement au plasma d'un substrat creux non conducteur (5), qui comprend une chambre de plasma (12) munie de deux fenêtres d'admission de champ opposées (8, 9), et des premier et second agencements de bobine opposés (20, 30) situés sur la surface extérieure (8a; 9a) respectivement des première et seconde fenêtres. Ces agencements de bobine étant connectés à des éléments d'alimentation (4) de manière qu'un courant (I) de même direction s'écoule simultanément dans le premier et le second agencements de bobine. Les deux agencements de bobine (20, 30) induisent à travers le substrat un flux magnétique (7) transversal et perpendiculaire à la profondeur (L) du substrat en vue de produire un champ électrique dans le plan du substrat.

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