Method and apparatus for laminating flexible printed circuits

Details Method and apparatus for laminating flexible printed circuits Method and apparatus for laminating flexible printed circuits

H - Electricity

05

K

154/140, 356/22,

H05K 1/03 (2006.01) B30B 15/06 (2006.01) B32B 27/08 (2006.01) H05K 3/02 (2006.01)

Patent

CA 1225163

Abstract of the Disclosure An article of manufacture and method for assisting the lamination of printed circuits in a flat bed press, in which a stratiform sheet has a thermoplastic layer, a polymeric release layer on one side, a polymeric stabilizing layer having a melting point higher than the laminating temperature peak on the other side, both bonded to the middle thermoplastic layer which has a glass transition point lower than top laminating temperature peak, and a melting point higher than the peak, and the sheet is characterized by substantial freedom from creases, trapped gases, and contaminants between the layers, and the improved method using the stratiform sheet in a flat bed press operation.

474404

Affiliated with

Also associated with

Rating

Method and apparatus for laminating flexible printed circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for laminating flexible printed circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for laminating flexible printed circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1239682