Method and apparatus for laser cutting materials

Details Method and apparatus for laser cutting materials Method and apparatus for laser cutting materials

B - Operations, Transporting

23

K

B23K 26/04 (2006.01) B23K 26/08 (2006.01) B23K 26/14 (2006.01)

Patent

CA 2234895

An improved method and apparatus of cutting an object with a laser beam, comprising using a diode laser-pumped pulsed solid state laser having an average power output from about 2 to about 100 watts and delivering an average laser beam brightness of greater than 1012 W/m2*sr and a peak brightness of greater than 1013 W/m2*sr to the object. Objects cut with the laser cutting method having heat affected zones (HAZ) of less than 4 mm, and having substantially no microcracks.

L'invention porte sur un procédé et un appareil de découpage d'objets au laser recourant à un laser solide pulsé à pompage par diode laser d'une puissance de sortie moyenne d'environ 2 à environ 100 W et dirigeant sur l'objet un faisceau d'une brillance moyenne supérieure à 10?12¿ W/m?2¿*sr et atteignant des pics de 10?13¿ W/m?2¿*sr. Les objets découpés par ce procédé présentent des zones affectées par la chaleur de moins de 4 mm et sont sensiblement exempts de microfissures.

Affiliated with

Also associated with

Rating

Method and apparatus for laser cutting materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for laser cutting materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for laser cutting materials will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1593340