Method and apparatus for laser processing of materials

Details Method and apparatus for laser processing of materials Method and apparatus for laser processing of materials

B - Operations, Transporting

23

K

327/1.3, 327/1.5

B23K 26/00 (2006.01) B23K 26/06 (2006.01) B23K 26/36 (2006.01) H01S 3/10 (2006.01) H01S 3/104 (2006.01)

Patent

CA 1294009

Abstract of the Disclosure An improved method of laser processing of a material by directing a laser beam against the material comprises providing the beam with a power waveform with respect to time characterized by a plurality of peak power pulses and a predetermined CW power level between the peak power pulses such that the average beam power maintained is equal to or greater than the predetermined CW power level of the beam. The method is particularly adapted for cutting material such as aluminum, copper and stainless steel with improved cut quality at a relatively high cutting speed and for welding.

554157

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