Method and apparatus for localized control of a plasma cutter

Details Method and apparatus for localized control of a plasma cutter Method and apparatus for localized control of a plasma cutter

B - Operations, Transporting

23

K

B23K 10/00 (2006.01) B23K 31/10 (2006.01) H05H 1/26 (2006.01) H05H 1/36 (2006.01) H05H 1/34 (2006.01)

Patent

CA 2481197

The present invention is directed to a system and method for a plasma cutting system including a plasma cutting power source and a plasma torch operationally connected to the plasma cutting power source. A processing unit is disposed within the plasma torch and is configured to control the plasma cutting power source during a plasma cutting process teased on operational feedback gathered of the plasma cutting process.

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