Method and apparatus for manufacturing a device

B - Operations – Transporting – 29 – C

Patent

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Details

B29C 45/26 (2006.01) B29C 33/38 (2006.01) B29C 33/42 (2006.01) B29C 45/37 (2006.01)

Patent

CA 2318011

A device, preferably a micro-device, is molded from a plastic material by injection molding, compression molding or embossing. A microabrader can be molded having microneedles for abrading the stratum corneum of the skin to form an abraded site in the tissue for enhancing drug delivery. The micro-device is molded using a mold assembly having a silicon molding surface. The silicon molding surface can include a recess corresponding to the desired shape and length of the microneedles. The silicon molding surface enables micron and submicron size features to be molded from polymeric materials without the polymeric material adhering to the mold surface. Micro-devices having molded features having micron and submicron dimensions can be rapidly produced without the use of a release agent.

Dispositif, de préférence un microdispositif, moulé dans une matière plastique par injection, par compression ou gaufrage. Il est ainsi possible de mouler un microabraseur comportant des microaiguilles servant à abraser la couche cornée de l'épiderme pour former un site abrasé dans le tissu afin d'améliorer l'administration de médicaments. Le microdispositif est moulé au moyen d'un ensemble de moulage comportant une surface de moulage en silicone. Cette surface peut comprendre un renfoncement correspondant à la forme et à la longueur désirées des microaiguilles. La surface de moulage en silicone permet le moulage de caractéristiques de l'ordre du micron et de l'ultramicron au moyen de matières polymériques, sans que ces dernières n'adhèrent à la surface de moulage. Il est donc possible de produire rapidement des microdispositifs possédant des caractéristiques moulées et présentant une taille de l'ordre du micron et de l'ultramicron, et ce, sans avoir recours à un démoulant.

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