Method and apparatus for mask/wafer alignment

Details Method and apparatus for mask/wafer alignment Method and apparatus for mask/wafer alignment

G - Physics

01

B

356/177, 33/53

G01B 11/27 (2006.01) G03F 9/00 (2006.01)

Patent

CA 1154175

METHOD AND APPARATUS FOR MASK/WAFER ALIGNMENT Abstract Zone plate patterns formed on spaced-apart mask and wafer members are utilized for alignment purposes in the fabrication of integrated circuits. By providing off-axis illumination of the patterns, a significant mask- to-wafer alignment capability is provided in an X-ray lithographic system. This capability includes being able to correct for so-called magnification errors that arise from physical distortions in the mask and/or wafer or in other components of the system. These errors are compensated for by utilizing the zone plate patterns to form alignment marks that serve as a basis for adjusting the mask-to-wafer separation.

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