H - Electricity – 01 – R
Patent
H - Electricity
01
R
339/110, 26/139
H01R 43/04 (2006.01) H01R 43/20 (2006.01)
Patent
CA 2010323
METHOD AND APPARATUS FOR MICROMINIATURIZED HEADER ASSEMBLY ABSTRACT OF THE DISCLOSURE A header assembly for use in making electrical contact through the wall or bulkhead of a device such as a laser gyro which utilizes standard available components and is constructed in accordance with standard available procedures so as to effectuate a lower cost-effective header.
Honeywell Inc.
Smart & Biggar
LandOfFree
Method and apparatus for microminiaturized header assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for microminiaturized header assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for microminiaturized header assembly will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1833196