B - Operations – Transporting – 21 – F
Patent
B - Operations, Transporting
21
F
18/909
B21F 15/02 (2006.01) H02G 15/196 (2006.01)
Patent
CA 1063764
METHOD AND APPARATUS FOR MOLDING SPLICES IN CABLES Abstract of the Disclosure A molded cable splice is formed by wrapping strip- formed semiconducting and insulative thermosetting molding compounds about a layer of semiconducting tape covering a connector and exposed central conductors of a pair of cable ends joined by the connector, and bonding the insulative molding compound to the cable insulation layer in a heated mold having opposing end clamp portions each with an inner surface of a predetermined radius and length. The radius is selected in accordance with the formula Image , where r is the radius of the cables to be joined and X is a numerical quantity called the cable clamp factor. For cables having an ethylene propylene rubber insulation layer, X lies in the range from about 0.20 to about 0.50; for cables with a cross-linked polyethylene insulation layer, X is partially dependent on insulation thickness W and lies between a lower range of from about 0.50 to about 0.76 for W = 0.175 inch and an upper range of from about 0.87 to about 1.00 for W = 0.900 inch. The axial length of the end clamp portions optimally lies in the range from about 2.5 to about 3.5 inches. The end clamp portions may also be tapered in the outward direction, with the taper angle preferably in the range from 2 to 4 degrees, and the radius at substantially the mid-point between the inner and outer boundary of each end clamp portion selected in accordance with the above formula.
245121
Na
Townsend And Townsend (a Partnership)
LandOfFree
Method and apparatus for molding splices in cables does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for molding splices in cables, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for molding splices in cables will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-989839