Method and apparatus for mounting lead sockets to an...

Details Method and apparatus for mounting lead sockets to an... Method and apparatus for mounting lead sockets to an...

H - Electricity

05

K

26/31

H05K 3/30 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1082895

A B S T R A C T A method for mounting lead sockets in the holes in an electrical interconnection board. The lead sockets are hollow cylindrical elements having a tapered opening at one end and a plurality of normally converging flexible fingers at the other end. The lead sockets are force fitted into the holes in the board with the receptacle end of the socket opening into the component side of the board. The lead sockets are vibrated into place while a vacuum is applied to temporarily seat the lead sockets in the holes in the board. The lead sockets are then finally force fitted into the holes in the board by several alternative means. The apparatus for accomplishing the method of this invention is also disclosed.

290580

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