Method and apparatus for optical emission end point...

Details Method and apparatus for optical emission end point... Method and apparatus for optical emission end point...

G - Physics

01

J

G01J 3/443 (2006.01) H01J 37/32 (2006.01) H01L 21/3065 (2006.01)

Patent

CA 2104072

An apparatus and method for determining the time at which a plasma etching process should be terminated. The process generates at least one etch product species and a continuum plasma emission. The apparatus monitors the optical emission intensity of the plasma in a narrow band centered about a predetermined spectral line and generates a first signal indicative of the spectral intensity of the etch product species. The apparatus further monitors the optical emission intensity of the plasma in a wide band and generates a second signal indicative of the spectral intensity of the continuum plasma emission. The apparatus further monitors the magnitudes of the first and second signals and generates a termination signal when the magnitudes diverge.

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