Method and apparatus for placing sensors using 3d models

H - Electricity – 04 – N

Patent

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H04N 7/18 (2006.01)

Patent

CA 2534747

Method and apparatus for dynamically placing sensors in a 3D model (101) is provided. Specifically, in one embodiment, the method selects a 3D model (101) and a sensor for placement into the 3D model (101). The method renders the sensor and the 3D model (101) in accordance with sensor parameters associated with the sensor and parameters desired by a user. In addition, the method determines whether an occlusion to the sensor is present.

L'invention concerne un procédé et un appareil permettant de placer de manière dynamique des capteurs dans un modèle 3D. De manière plus spécifique, dans un mode de réalisation, le procédé consiste à sélectionner un modèle 3D et un capteur destiné à être placé dans le modèle 3D. Le procédé permet d'obtenir un rendu du capteur et du modèle 3D conformément aux paramètres de capteur associés au capteur et aux paramètres souhaités par un utilisateur. En outre, le procédé consiste à déterminer si une occlusion du capteur est présente.

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