Method and apparatus for plasma cutting

Details Method and apparatus for plasma cutting Method and apparatus for plasma cutting

B - Operations, Transporting

23

K

B23K 10/00 (2006.01)

Patent

CA 2191208

A method and an apparatus for plasma cutting wich can produce a cut product having less dross affixed thereto and a clear cut surface and which is capable of high-speed cutting even at the time of piercing. Due to this, at the time of piercing oxidizable gas (O2) is used as plasma gas and at the time of cutting non-oxidizable gas (N2) is used as plasma gas to cut a material (6) to be cut. In addition, when shifting from piercing to cutting the supply of non oxydizable gas (N2) may be started before the supply of oxydizable gas (O2) is stopped.

Procédé et appareil de découpage au plasma produisant moins d'impuretés et une surface de coupe plus nette et à grande vitesse de coupe même en cas de perforations. Pour cela le plasma utilisé pour les perforations est fait d'un gaz oxydant (O¿2?), et celui utilisé pour le découpage du matériau (6), d'un gaz non oxydant (N¿2?). Lorsqu'on passe du perçage au découpage, la source de N¿2? peut être ouverte avant que celle d'O¿2? ne soit coupée.

Affiliated with

Also associated with

Rating

Method and apparatus for plasma cutting does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for plasma cutting, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for plasma cutting will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1747783