Method and apparatus for producing moulded wafers

Details Method and apparatus for producing moulded wafers Method and apparatus for producing moulded wafers

A - Human Necessities

47

J

65/13

A47J 31/00 (2006.01) A21B 5/02 (2006.01) A21C 15/02 (2006.01)

Patent

CA 1120738

W.519 ABSTRACT Moulded wafer products are prepared by a novel process in novel apparatus from dough of high sugar content (25-60% w/w based on the farinaceous dough ingredient) by a two- stage process comprising initial baking of a light-textured wafer material (e.g. 2-3 mm thick), introducing the water while still hot (e.g. above 160-195°C), into a cooling and compressing mould of the apparatus, and compressing the wafer to reduce its wall thickness, e.g. by about 15-50%.

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