H - Electricity – 01 – L
Patent
H - Electricity
01
L
26/200
H01L 21/308 (2006.01) B41J 2/16 (2006.01) G03F 7/20 (2006.01)
Patent
CA 1087384
METHOD OF ETCHING UNIFORM HOLES IN SUBSTRATES FOR THE FABRICATION OF INK JET NOZZLES AND THE LIKE Abstract of the Disclosure Nozzle arrays for ink jet recording are produced by preferred chemical etching of a substrate material which frequently has a non- uniform thickness. The preferred substrate is a monocrystalline silicon wafer and the 100 plane surface of the wafer is coated with etchant masking material and the resist coated wafer is held in close physical contact with a base member. A suitable mask member which defines a nozzle array pattern is spaced a predetermined distance from the base member and is positioned parallel to the base member. The wafer is then exposed through the mask by a suitable light source arranged at a suitable angle while the wafer is simultaneously rotated about an axis perpendicular to the wafer. The wafer is then exposed to anisotropic etching to produce a uniform array of nozzles in the wafer wherein the lateral walls of the nozzles are substantially in the "111" plane of the wafer. The masking material is then stripped from the wafer.
309385
International Business Machines Corporation
Kerr Alexander
LandOfFree
Method and apparatus for producing nozzle arrays for ink jet... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for producing nozzle arrays for ink jet..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for producing nozzle arrays for ink jet... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-31110