Method and apparatus for providing power to a microprocessor...

Details Method and apparatus for providing power to a microprocessor... Method and apparatus for providing power to a microprocessor...

H - Electricity

05

K

H05K 7/10 (2006.01) G06F 1/18 (2006.01) H01L 23/427 (2006.01) H05K 1/14 (2006.01) H05K 1/02 (2006.01) H05K 3/30 (2006.01) H05K 3/36 (2006.01)

Patent

CA 2400568

A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

L'invention concerne une architecture d'emballage de microprocesseur utilisant un ensemble de carte de circuit modulaire qui produit du courant ~ un microprocesseur, tandis qu'il g~n­re ~galement une interf~rence ~lectromagn~tique (EMI) et thermique int~gr~e. Ledit ensemble de carte de circuit modulaire comprend un substrat pourvu d'un composant, une carte de circuit comprenant un circuit d'alimentation du composant et au moins un dispositif d'interconnexion conducteur dispos~ entre le substrat et la carte de circuit, ledit dispositif d'interconnexion ~tant configur~ pour coupler ~lectriquement le circuit au composant.

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