Method and apparatus for reducing a skin effect in a...

Details Method and apparatus for reducing a skin effect in a... Method and apparatus for reducing a skin effect in a...

E - Fixed Constructions

21

B

E21B 43/00 (2006.01) E21B 28/00 (2006.01)

Patent

CA 2581165

A method for reducing a skin effect in a downhole environment is provided, including the step of radiating vibrational waves at a wellbore wall such that the vibrational waves have at least one direction of greatest vibrational energy transfer directed toward the wall, thereby reducing the skin effect. An apparatus for reducing a skin effect in a downhole environment is also provided. The apparatus includes at least one vibrational wave source having at least one direction of greatest vibrational energy transfer, and a means for positioning the vibrational wave source proximate a wellbore wall.

La présente invention concerne un procédé pour réduire un effet pariétal dans un environnement de fond de puits comprenant une étape d'irradiation des ondes vibratoires sur une paroi du puits de forage, de sorte que ces ondes aient au moins une direction de transfert d'énergie vibratoire supérieur, dirigée vers la paroi, ce qui réduit l'effet pariétal. L'invention prévoit aussi un appareil pour réduire un effet pariétal dans un environnement de fond de puits. Celui-ci comprend au moins une source d'onde vibratoire, ayant au moins une direction avec transfert d'énergie vibratoire supérieur et un moyen pour placer la source d'onde vibratoire près d'une paroi du puits de forage.

Affiliated with

Also associated with

Rating

Method and apparatus for reducing a skin effect in a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for reducing a skin effect in a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for reducing a skin effect in a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1982488